Structural Analysis Of Stretchable Electronics Joint Under Tensile And Vibration Loading

• Main Author: Mustaffa, Nadirah
• Format: Monograph
• Language: English
• Published: Universiti Sains Malaysia 2017
• Subjects: T Technology; TJ Mechanical engineering and machinery
• Online Access: http://eprints.usm.my/54406/1/Structural%20Analysis%20Of%20Stretchable%20Electronics%20Joint%20Under%20Tensile%20And%20Vibration%20Loading_Nadirah%20Mustaffa_M4_2017.pdf; http://eprints.usm.my/54406/

Solder joint is the major part of electronic devices to form an electrical connection and mechanical bond. Thus, study of electronics joint reliability is significant to determine the ability of the interconnection to maintain its functionality under subjected environments. Reliability of electronic...