Comparison Between Vertical-Stand Packaging And Planar-Mounted Packaging For Gan On Gan Led

• Main Authors: Alias, E. A., Samsudin, M. E. A., Zainal, N., Iza, M., Hassan, Abdullah I., Denbaars, S. P., Speck, J. S., Nakamura, S.
• Format: Conference or Workshop Item
• Language: English
• Published: 2019
• Subjects: QC1-999 Physics
• Online Access: http://eprints.usm.my/48880/1/ICoSeMT%202019%20ABSTRACT%20BOOK%20154.pdf; http://eprints.usm.my/48880/

Due to the fact that light extraction efficiency of white InGaN LEDs grown on GaN substrate is low as a result from total internal reflection phenomena, therefore flip chip, chip shaping and roughening p-GaN have been proposed. However, these methods are inefficient to extract the light as the GaN s...