Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging

• Main Author: Pang, Shi Shiang
• Format: Thesis
• Language: English
• Published: 2020
• Subjects: T Technology
• Online Access: http://eprints.usm.my/47762/1/Thermal%20Impact%20Of%20Thermal%20Interface%20Materials%20And%20Heat%20Spreader%20Co-Planarity%20Of%20The%20Electronic%20Packaging.pdf; http://eprints.usm.my/47762/

This thesis presents the thermal impact of thermal interface material 1 (TIM1) and heat spreader co-planarity to the flip chip package with heat spreader. The TIM1 material influences the efficiency of heat transfer from silicon die to the heat spreader while the co-planarity of heat spreader affect...