Pang, S. S. (2020). Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging.
Chicago Style CitationPang, Shi Shiang. Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging. 2020.
MLA CitationPang, Shi Shiang. Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging. 2020.
Warning: These citations may not always be 100% accurate.