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Computational methods in Flipchip assembly.

Flip chip technology, in the book edited by Lau (Lau, 1995) is defined as placing a chip to the substrate by flipping over the chip so that the I/O area of the chip is facing the substrate. By flipping over the chip, the interconnection between the chip and the substrate are achieved by conductive...

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Main Authors: Hj Abdul Azid, Ishak, Seetharamu, K.N., Abdul Quadir, Ghulam
Format: Monograph
Published: Universiti Sains Malaysia 2002
Subjects:
TJ1-1570 Mechanical engineering and machinery
Online Access:http://eprints.usm.my/10584/
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id my.usm.eprints.10584
record_format eprints
spelling my.usm.eprints.10584 http://eprints.usm.my/10584/ Computational methods in Flipchip assembly. Hj Abdul Azid, Ishak Seetharamu, K.N. Abdul Quadir, Ghulam TJ1-1570 Mechanical engineering and machinery Flip chip technology, in the book edited by Lau (Lau, 1995) is defined as placing a chip to the substrate by flipping over the chip so that the I/O area of the chip is facing the substrate. By flipping over the chip, the interconnection between the chip and the substrate are achieved by conductive "bumps" placed directly in between the die surface and the substrate. Therefore, the whole chip surface can be utilized for active interconnections and at the same time, eliminates the need for wire bonding. Universiti Sains Malaysia 2002-08 Monograph NonPeerReviewed Hj Abdul Azid, Ishak and Seetharamu, K.N. and Abdul Quadir, Ghulam (2002) Computational methods in Flipchip assembly. Project Report. Universiti Sains Malaysia.
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
topic TJ1-1570 Mechanical engineering and machinery
spellingShingle TJ1-1570 Mechanical engineering and machinery
Hj Abdul Azid, Ishak
Seetharamu, K.N.
Abdul Quadir, Ghulam
Computational methods in Flipchip assembly.
description Flip chip technology, in the book edited by Lau (Lau, 1995) is defined as placing a chip to the substrate by flipping over the chip so that the I/O area of the chip is facing the substrate. By flipping over the chip, the interconnection between the chip and the substrate are achieved by conductive "bumps" placed directly in between the die surface and the substrate. Therefore, the whole chip surface can be utilized for active interconnections and at the same time, eliminates the need for wire bonding.
format Monograph
author Hj Abdul Azid, Ishak
Seetharamu, K.N.
Abdul Quadir, Ghulam
author_facet Hj Abdul Azid, Ishak
Seetharamu, K.N.
Abdul Quadir, Ghulam
author_sort Hj Abdul Azid, Ishak
title Computational methods in Flipchip assembly.
title_short Computational methods in Flipchip assembly.
title_full Computational methods in Flipchip assembly.
title_fullStr Computational methods in Flipchip assembly.
title_full_unstemmed Computational methods in Flipchip assembly.
title_sort computational methods in flipchip assembly.
publisher Universiti Sains Malaysia
publishDate 2002
url http://eprints.usm.my/10584/
_version_ 1643701574619365376
score 13.160551

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