Drop impact testing for Pb-freee aloy on IC packaging
Soldering is one of the techniques for interconnects which provides the conductive path from one circuit to others circuit element. In the other hands, soldering cover pats of its structural strength, electrical connection, grounding and signal transmission. The process of interconnection must be in...
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| Main Authors: | , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
Faculty of Computer Science and Information Technology, Universiti Putra Malaysia
2015
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| Online Access: | http://psasir.upm.edu.my/id/eprint/77196/1/saes2015-50.pdf http://psasir.upm.edu.my/id/eprint/77196/ |
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