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Drop impact testing for Pb-freee aloy on IC packaging

Soldering is one of the techniques for interconnects which provides the conductive path from one circuit to others circuit element. In the other hands, soldering cover pats of its structural strength, electrical connection, grounding and signal transmission. The process of interconnection must be in...

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Main Authors: Ismail, Noor Faezah, Sulaiman, Nasri, Md Yunus, Nurul Amziah
Format: Conference or Workshop Item
Language:English
Published: Faculty of Computer Science and Information Technology, Universiti Putra Malaysia 2015
Online Access:http://psasir.upm.edu.my/id/eprint/77196/1/saes2015-50.pdf
http://psasir.upm.edu.my/id/eprint/77196/
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spelling my.upm.eprints.771962020-03-04T06:57:35Z http://psasir.upm.edu.my/id/eprint/77196/ Drop impact testing for Pb-freee aloy on IC packaging Ismail, Noor Faezah Sulaiman, Nasri Md Yunus, Nurul Amziah Soldering is one of the techniques for interconnects which provides the conductive path from one circuit to others circuit element. In the other hands, soldering cover pats of its structural strength, electrical connection, grounding and signal transmission. The process of interconnection must be in a proper way so that it will produce a good interconnection while a bad interconnection can cause a weak adhesion, which lead to bad results and minimize the lifetime of the devices. The heavy the weight of object, the stronger impact force will be experienced. Faculty of Computer Science and Information Technology, Universiti Putra Malaysia 2015 Conference or Workshop Item PeerReviewed text en http://psasir.upm.edu.my/id/eprint/77196/1/saes2015-50.pdf Ismail, Noor Faezah and Sulaiman, Nasri and Md Yunus, Nurul Amziah (2015) Drop impact testing for Pb-freee aloy on IC packaging. In: 3rd International Symposium on Applied Engineering and Sciences (SAES2015), 23-24 Nov. 2015, Universiti Putra Malaysia. (pp. 288-290).
institution Universiti Putra Malaysia
building UPM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Putra Malaysia
content_source UPM Institutional Repository
url_provider http://psasir.upm.edu.my/
language English
description Soldering is one of the techniques for interconnects which provides the conductive path from one circuit to others circuit element. In the other hands, soldering cover pats of its structural strength, electrical connection, grounding and signal transmission. The process of interconnection must be in a proper way so that it will produce a good interconnection while a bad interconnection can cause a weak adhesion, which lead to bad results and minimize the lifetime of the devices. The heavy the weight of object, the stronger impact force will be experienced.
format Conference or Workshop Item
author Ismail, Noor Faezah
Sulaiman, Nasri
Md Yunus, Nurul Amziah
spellingShingle Ismail, Noor Faezah
Sulaiman, Nasri
Md Yunus, Nurul Amziah
Drop impact testing for Pb-freee aloy on IC packaging
author_facet Ismail, Noor Faezah
Sulaiman, Nasri
Md Yunus, Nurul Amziah
author_sort Ismail, Noor Faezah
title Drop impact testing for Pb-freee aloy on IC packaging
title_short Drop impact testing for Pb-freee aloy on IC packaging
title_full Drop impact testing for Pb-freee aloy on IC packaging
title_fullStr Drop impact testing for Pb-freee aloy on IC packaging
title_full_unstemmed Drop impact testing for Pb-freee aloy on IC packaging
title_sort drop impact testing for pb-freee aloy on ic packaging
publisher Faculty of Computer Science and Information Technology, Universiti Putra Malaysia
publishDate 2015
url http://psasir.upm.edu.my/id/eprint/77196/1/saes2015-50.pdf
http://psasir.upm.edu.my/id/eprint/77196/
_version_ 1662756628521287680
score 13.211869

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