Metallization process for alumina substrates

• Main Authors: Mohd Shapee, Sabrina, Alias, Rosidah, Ibrahim, Azmi, Yahya, Mohamed Razman, Awang Mat, Abdul Fatah, Hashim, Mansor
• Format: Conference or Workshop Item
• Language: English
• Published: Universiti Putra Malaysia Press 2005
• Online Access: http://psasir.upm.edu.my/id/eprint/38675/1/38675.pdf; http://psasir.upm.edu.my/id/eprint/38675/

Alumina substrate has been widely used as a substrate material for ceramic packaging technology. This material shows the excellent combination of electrical, mechanical and thermal properties. Metallization process is a process used for making electrically conductive interconnects on insulating subs...