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Metallization process for alumina substrates

Alumina substrate has been widely used as a substrate material for ceramic packaging technology. This material shows the excellent combination of electrical, mechanical and thermal properties. Metallization process is a process used for making electrically conductive interconnects on insulating subs...

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Main Authors: Mohd Shapee, Sabrina, Alias, Rosidah, Ibrahim, Azmi, Yahya, Mohamed Razman, Awang Mat, Abdul Fatah, Hashim, Mansor
Format: Conference or Workshop Item
Language:English
Published: Universiti Putra Malaysia Press 2005
Online Access:http://psasir.upm.edu.my/id/eprint/38675/1/38675.pdf
http://psasir.upm.edu.my/id/eprint/38675/
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spelling my.upm.eprints.386752018-09-25T01:29:40Z http://psasir.upm.edu.my/id/eprint/38675/ Metallization process for alumina substrates Mohd Shapee, Sabrina Alias, Rosidah Ibrahim, Azmi Yahya, Mohamed Razman Awang Mat, Abdul Fatah Hashim, Mansor Alumina substrate has been widely used as a substrate material for ceramic packaging technology. This material shows the excellent combination of electrical, mechanical and thermal properties. Metallization process is a process used for making electrically conductive interconnects on insulating substrate like alumina substrates. Three fundamental methods of metallizing alumina substrates include thick film, thin film and copper metallization technology. In this paper, the RF magnetron sputtering method was used to deposit copper conductor on alumina substrate surface. Universiti Putra Malaysia Press 2005 Conference or Workshop Item NonPeerReviewed application/pdf en http://psasir.upm.edu.my/id/eprint/38675/1/38675.pdf Mohd Shapee, Sabrina and Alias, Rosidah and Ibrahim, Azmi and Yahya, Mohamed Razman and Awang Mat, Abdul Fatah and Hashim, Mansor (2005) Metallization process for alumina substrates. In: International Advanced Technology Congress: Conference on Advanced Materials (CAM 2005), 6-8 Dec. 2005, Putrajaya, Malaysia. (pp. 181-184).
institution Universiti Putra Malaysia
building UPM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Putra Malaysia
content_source UPM Institutional Repository
url_provider http://psasir.upm.edu.my/
language English
description Alumina substrate has been widely used as a substrate material for ceramic packaging technology. This material shows the excellent combination of electrical, mechanical and thermal properties. Metallization process is a process used for making electrically conductive interconnects on insulating substrate like alumina substrates. Three fundamental methods of metallizing alumina substrates include thick film, thin film and copper metallization technology. In this paper, the RF magnetron sputtering method was used to deposit copper conductor on alumina substrate surface.
format Conference or Workshop Item
author Mohd Shapee, Sabrina
Alias, Rosidah
Ibrahim, Azmi
Yahya, Mohamed Razman
Awang Mat, Abdul Fatah
Hashim, Mansor
spellingShingle Mohd Shapee, Sabrina
Alias, Rosidah
Ibrahim, Azmi
Yahya, Mohamed Razman
Awang Mat, Abdul Fatah
Hashim, Mansor
Metallization process for alumina substrates
author_facet Mohd Shapee, Sabrina
Alias, Rosidah
Ibrahim, Azmi
Yahya, Mohamed Razman
Awang Mat, Abdul Fatah
Hashim, Mansor
author_sort Mohd Shapee, Sabrina
title Metallization process for alumina substrates
title_short Metallization process for alumina substrates
title_full Metallization process for alumina substrates
title_fullStr Metallization process for alumina substrates
title_full_unstemmed Metallization process for alumina substrates
title_sort metallization process for alumina substrates
publisher Universiti Putra Malaysia Press
publishDate 2005
url http://psasir.upm.edu.my/id/eprint/38675/1/38675.pdf
http://psasir.upm.edu.my/id/eprint/38675/
_version_ 1643832207025897472
score 13.160551

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