Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number
An impetus has been provided towards the development of lead-free solders by worldwide environmental legislation that banned the use of lead in solders due to the lead toxicity. This study focus on Bi-Ag and Bi-Sb solder alloys, in compositions from 1.5 to 5 wt % Ag and Sb. The effects of Ag and Sb...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Trans Tech Publications
2014
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| Online Access: | http://psasir.upm.edu.my/id/eprint/34519/1/Microstructural%20evaluation%20of%20Bi-Ag%20and%20Bi-Sb%20lead-free%20high-temperature%20solder%20candidates%20on%20copper%20substrate%20with%20multiple%20reflow%20number.pdf http://psasir.upm.edu.my/id/eprint/34519/ http://www.scientific.net/AMM.564.388 |
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| Summary: | An impetus has been provided towards the development of lead-free solders by worldwide environmental legislation that banned the use of lead in solders due to the lead toxicity. This study focus on Bi-Ag and Bi-Sb solder alloys, in compositions from 1.5 to 5 wt % Ag and Sb. The effects of Ag and Sb amount, and reflow number on the microstructure and morphology of solder bulk were analysed by optical microscope and scanning electron microscope-energy dispersive X-ray. Based on the results, the grain boundary grooving was observed in all samples except Bi-5Sb in all three reflows. Metallurgical and chemical reaction between interface and solders were found in Bi-5Sb solder alloys in different reflow numbers which lead to appearance of Cu3Sb intermetallic compound layer at the interface. Reflow numbers had a significant effect on the size of Cu-rich phase. Also it was observed that, with increasing reflow number Bi-Cu phase found in Bi-2.5Sb solder dissolves into the solder bulk. |
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