Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings

• Main Authors: Mohd Nordin, Muhammad Haziq Iqmal, Hamzah, Khairum, Nik Long, Nik Mohd Asri, Khashi’ie, Najiyah Safwa, Waini, Iskandar, Zainal, Nurul Amira, Sayed Nordin, Sayed Kushairi
• Format: Article
• Published: MDPI 2024
• Online Access: http://psasir.upm.edu.my/id/eprint/106276/; https://www.scopus.com/inward/record.uri?eid=2-s2.0-85183877145&url=10.37934%2faram.113.1.2736&partnerID=40&md5=42d4c6a3f85170714c1979412bb594ec

In this study, a curvilinear crack phenomenon laying in the upper part of thermoelectric bonded materials subject to mechanical loadings is considered. A curvilinear crack problem in thermoelectric bonded materials subjected to shear stress is formulated. The modified complex potential (MCP) functio...