Formulation for multiple cracks problem in thermoelectric-bonded materials using hypersingular integral equations
New formulations are produced for problems associated with multiple cracks in the upper part of thermoelectric-bonded materials subjected to remote stress using hypersingular integral equations (HSIEs). The modified complex stress potential function method with the continuity conditions of the resul...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023
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| Online Access: | http://eprints.utem.edu.my/id/eprint/27491/2/0215302082023280.PDF http://eprints.utem.edu.my/id/eprint/27491/ https://www.mdpi.com/2227-7390/11/14/3248 https://doi.org/10.3390/math11143248 |
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