Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings
In this study, a curvilinear crack phenomenon laying in the upper part of thermoelectric bonded materials subject to mechanical loadings is considered. A curvilinear crack problem in thermoelectric bonded materials subjected to shear stress is formulated. The modified complex potential (MCP) functio...
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Main Authors: | , , , , , , |
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Format: | Article |
Published: |
MDPI
2024
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Online Access: | http://psasir.upm.edu.my/id/eprint/106276/ https://www.scopus.com/inward/record.uri?eid=2-s2.0-85183877145&url=10.37934%2faram.113.1.2736&partnerID=40&md5=42d4c6a3f85170714c1979412bb594ec |
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