Characterization study for polymer core solder balls under AC and TC reliability test
Since Restriction of Hazardous Substance (RoHS) Regulation came into effect in year 2006 due to the hazardous effects of lead to human's health and toxicity for environment, Ball Grid Array (BGA) semiconductor chip are widely used for many electronic applications including portable, automotive...
Saved in:
Main Authors: | Tan, C.H., Yap, B.K., Tan, C.Y. |
---|---|
Format: | |
Published: |
2018
|
Online Access: | http://dspace.uniten.edu.my/jspui/handle/123456789/8772 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests
by: Kar, Y.B., et al.
Published: (2018) -
Solder ball robustness study on polymer core solder balls for BGA packages
by: Kar, Y.B., et al.
Published: (2018) -
Comparison study on shear strength and intermetallic compound for SAC and polymer core solder balls
by: Kar, Y.B., et al.
Published: (2018) -
Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performance
by: Eu, P.L., et al.
Published: (2017) -
Structural And Reliability Analysis Of Solder Joint Under Vibration Loading
by: Ilias, Muhammad Ikmal
Published: (2018)