Characterization study for polymer core solder balls under AC and TC reliability test
Since Restriction of Hazardous Substance (RoHS) Regulation came into effect in year 2006 due to the hazardous effects of lead to human's health and toxicity for environment, Ball Grid Array (BGA) semiconductor chip are widely used for many electronic applications including portable, automotive...
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2018
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| Online Access: | http://dspace.uniten.edu.my/jspui/handle/123456789/8772 |
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