A study on lead free SnAgCu solder system
This paper study Sn-Ag-Cu solder alloy compositions towards mechanical, surface elemental and thermal properties. Mechanical properties were evaluated by shear strength, while the solder surface oxide depth profile and melting properties were obtained by Auger and Differential Scanning Calorimetry (...
Saved in:
Main Authors: | , , , |
---|---|
Format: | |
Published: |
2017
|
Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5298 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Be the first to leave a comment!