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A study on lead free SnAgCu solder system

This paper study Sn-Ag-Cu solder alloy compositions towards mechanical, surface elemental and thermal properties. Mechanical properties were evaluated by shear strength, while the solder surface oxide depth profile and melting properties were obtained by Auger and Differential Scanning Calorimetry (...

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Main Authors: Hoh, H.J., Eu, P.L., Ding, M., Ahmad, I.
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Published: 2017
Online Access:http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5298
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spelling my.uniten.dspace-52982017-11-15T02:57:23Z A study on lead free SnAgCu solder system Hoh, H.J. Eu, P.L. Ding, M. Ahmad, I. This paper study Sn-Ag-Cu solder alloy compositions towards mechanical, surface elemental and thermal properties. Mechanical properties were evaluated by shear strength, while the solder surface oxide depth profile and melting properties were obtained by Auger and Differential Scanning Calorimetry (DSC) respectively. Overall results indicates that Sn3.8Ag0.7Cu having the most favorable results with highest shear strength, narrow melting peak and low surface oxidation. Further works done to understand in depth of the microstructure and elemental properties reveals that Sn3.8Ag0.7Cu has dendritic microstructure with Ag-Sn plate and Cu-Ni-Sn IMC interface. 2017-11-15T02:57:22Z 2017-11-15T02:57:22Z 2006 http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5298
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
description This paper study Sn-Ag-Cu solder alloy compositions towards mechanical, surface elemental and thermal properties. Mechanical properties were evaluated by shear strength, while the solder surface oxide depth profile and melting properties were obtained by Auger and Differential Scanning Calorimetry (DSC) respectively. Overall results indicates that Sn3.8Ag0.7Cu having the most favorable results with highest shear strength, narrow melting peak and low surface oxidation. Further works done to understand in depth of the microstructure and elemental properties reveals that Sn3.8Ag0.7Cu has dendritic microstructure with Ag-Sn plate and Cu-Ni-Sn IMC interface.
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author Hoh, H.J.
Eu, P.L.
Ding, M.
Ahmad, I.
spellingShingle Hoh, H.J.
Eu, P.L.
Ding, M.
Ahmad, I.
A study on lead free SnAgCu solder system
author_facet Hoh, H.J.
Eu, P.L.
Ding, M.
Ahmad, I.
author_sort Hoh, H.J.
title A study on lead free SnAgCu solder system
title_short A study on lead free SnAgCu solder system
title_full A study on lead free SnAgCu solder system
title_fullStr A study on lead free SnAgCu solder system
title_full_unstemmed A study on lead free SnAgCu solder system
title_sort study on lead free snagcu solder system
publishDate 2017
url http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5298
_version_ 1644493649743970304
score 13.18916

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