A study of lead-free BGA backward compatibility through solderability testing at component level
A study was conducted to assess the backward compatibility of two different lead-free BGA components using Jedec Solderability testing method (JESD22-B 102D). The test was conducted at component level. The two components tested were 29×29mm Thermally Enhanced PBGA (TePBGA-II) and 35×35mm Tape BGA (T...
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| Main Authors: | , , , |
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2017
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| Online Access: | http://dspace.uniten.edu.my:80/jspui/handle/123456789/5268 |
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