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An in-depth study of lead frame tape residue in quad flat non-leaded package

TK7872.T55 S57 2019

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Bibliographic Details
Main Author: Shri Kumaran Nadaraja
Format: text::Final Year Project
Language:English
Published: 2024
Subjects:
Thin film devices
Integrated circuits
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spelling my.uniten.dspace-324792024-06-02T02:01:25Z An in-depth study of lead frame tape residue in quad flat non-leaded package Shri Kumaran Nadaraja Thin film devices Integrated circuits TK7872.T55 S57 2019 Lead frame tape is crucial in the manufacturing of semiconductor integrated circuits (IC) as it acts as a support to the backside of the lead frame during the IC assembly process. The occurrence of Quad Flat Non-Leaded (QFN) tape residue is critical as affected IC units that are produced are of low reliability and fail electrical conductivity tests. This will influence overall performance of the chips and will contribute to a low pass yield as there are rejected units in the manufacturing industry. The occurrence of tape residue is studied by conducting an experiment using lead frame and tapes by three manufacturers with two die bond adhesives. Basic copper (Cu) wire bonding performances and die bonding performances are measured in terms of process capability, stitch bond strength and die attach strength are also discussed in this thesis to understand process limitations and challenges. The results are then compiled and analyzed to find a suitable combination of materials as a solution. Thermoplastic adhesive-based lead frame tape manufactured by Hitachi has no tape residue after de- taping in Mid-End Process. 2024-05-30T12:59:04Z 2024-05-30T12:59:04Z 2019 Resource Types::text::Final Year Project https://irepository.uniten.edu.my/handle/123456789/32479 en application/pdf
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
language English
topic Thin film devices
Integrated circuits
spellingShingle Thin film devices
Integrated circuits
Shri Kumaran Nadaraja
An in-depth study of lead frame tape residue in quad flat non-leaded package
description TK7872.T55 S57 2019
format Resource Types::text::Final Year Project
author Shri Kumaran Nadaraja
author_facet Shri Kumaran Nadaraja
author_sort Shri Kumaran Nadaraja
title An in-depth study of lead frame tape residue in quad flat non-leaded package
title_short An in-depth study of lead frame tape residue in quad flat non-leaded package
title_full An in-depth study of lead frame tape residue in quad flat non-leaded package
title_fullStr An in-depth study of lead frame tape residue in quad flat non-leaded package
title_full_unstemmed An in-depth study of lead frame tape residue in quad flat non-leaded package
title_sort in-depth study of lead frame tape residue in quad flat non-leaded package
publishDate 2024
_version_ 1806426261958950912
score 13.222552

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