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A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages

This study investigates the effects of two different catalytic activation techniques on the thermal performance of the flip-chip heat spreaders. The two activation techniques studied are thin nickel-copper strike and galvanic initiation. Thermal diffusivity and surface roughness of these heat spread...

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書誌詳細
主要な著者:	Amin N., Lim V., Seng F.C., Razid R., Ahmad I.
その他の著者:	7102424614
フォーマット:	論文
出版事項:	2023
主題:	Copper Electric batteries Electronics packaging Flip chip devices Heating equipment Mixed convection Nickel Nickel alloys Surface roughness Thermal conductivity Thermal diffusion Activation techniques After high temperatures Catalytic activations Copper heat spreaders Copper layers Copper strikes Flip chips Flip-chip ball grid arrays Heat spreaders High temperature storage tests Initial time Intermetallic diffusions Low thermal conductivities Practical investigations Semiconductor packages Thermal performance Spreaders
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