Effect of contact angle on meniscus evolution and contact line jump of underfill fluid flow in flip-chip encapsulation

• Main Authors: Ng F.C., Tung L.H., Zawawi M.H., Mukhtar M.A.F.M., Abas M.A., Abdullah M.Z.
• Other Authors: 57192101900
• Format: Article
• Published: Penerbit Akademia Baru 2023

Despite the contact angle of underfill fluid is largely correlated to the flowability, it was scarcely being investigated in the design optimization of flip-chip underfill encapsulation process. Furthermore, the detailed implication of the variation of contact angle on the flow mechanism was never b...