In depth study of lead frame tape residuein quad flat non-leaded package
Dies; Electronics packaging; Optimization; Reinforced plastics; Semiconductor device manufacture; Design/methodology/approach; Electrical conductivity; Lead frame; Process capabilities; Semiconductor manufacturing; Thermoplastic adhesive; Viable solutions; Wire bonding; Adhesives
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Emerald Group Holdings Ltd.
2023
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my.uniten.dspace-244262023-05-29T15:23:26Z In depth study of lead frame tape residuein quad flat non-leaded package Nadaraja S.K. Yap B.K. 57211503319 26649255900 Dies; Electronics packaging; Optimization; Reinforced plastics; Semiconductor device manufacture; Design/methodology/approach; Electrical conductivity; Lead frame; Process capabilities; Semiconductor manufacturing; Thermoplastic adhesive; Viable solutions; Wire bonding; Adhesives Purpose: Lead frame tape is a crucial support for lead frames in the IC assembly process. The tape residue on the quad flat non-leaded (QFN) could result in low reliability and failure in electrical conductivity tests. The tape residue would affect overall performance of the chips and contribute to low pass yield. The purpose of this paper is to present an in-depth study of tape residue and factors that may affect it. Design/methodology/approach: An experiment using lead frame and tapes from three manufacturers with two types of die bond adhesives, namely, die attach film (DAF) and wafer back coating (WBC), was conducted. Copper (Cu) wire bonding and die bonding performances were measured in terms of process capability, stitch bond strength and die attach strength. Findings: Results showed that no tape residue was observed on the thermoplastic adhesive-based lead frames manufactured by Hitachi after the de-taping process because of the tape�s thermoplastic adhesive properties. Originality/value: This paper studies the occurrence of tape residue and a viable solution for it through the correct process optimization and combination of semiconductor manufacturing materials. Factors that may affect tape residue have also been studied and further research can be done to explore other options in the future as an alternate solution. � 2019, Emerald Publishing Limited. Final 2023-05-29T07:23:25Z 2023-05-29T07:23:25Z 2019 Article 10.1108/MI-12-2018-0077 2-s2.0-85074210002 https://www.scopus.com/inward/record.uri?eid=2-s2.0-85074210002&doi=10.1108%2fMI-12-2018-0077&partnerID=40&md5=4833422ab342e5c3e5d2d1dae3c337e6 https://irepository.uniten.edu.my/handle/123456789/24426 36 4 129 136 Emerald Group Holdings Ltd. Scopus |
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Dies; Electronics packaging; Optimization; Reinforced plastics; Semiconductor device manufacture; Design/methodology/approach; Electrical conductivity; Lead frame; Process capabilities; Semiconductor manufacturing; Thermoplastic adhesive; Viable solutions; Wire bonding; Adhesives |
| author2 |
57211503319 |
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57211503319 Nadaraja S.K. Yap B.K. |
| format |
Article |
| author |
Nadaraja S.K. Yap B.K. |
| spellingShingle |
Nadaraja S.K. Yap B.K. In depth study of lead frame tape residuein quad flat non-leaded package |
| author_sort |
Nadaraja S.K. |
| title |
In depth study of lead frame tape residuein quad flat non-leaded package |
| title_short |
In depth study of lead frame tape residuein quad flat non-leaded package |
| title_full |
In depth study of lead frame tape residuein quad flat non-leaded package |
| title_fullStr |
In depth study of lead frame tape residuein quad flat non-leaded package |
| title_full_unstemmed |
In depth study of lead frame tape residuein quad flat non-leaded package |
| title_sort |
in depth study of lead frame tape residuein quad flat non-leaded package |
| publisher |
Emerald Group Holdings Ltd. |
| publishDate |
2023 |
| _version_ |
1806423298372796416 |
| score |
13.222552 |