Single & multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer
This paper describes the development work on single and multi beam laser grooving technology for 40nm node low-k/ULK semiconductor device. A Nd:YAG ultraviolet (UV) laser diode operating at a wavelength of 355 nm was used in this study. The effects of single and multi beam laser micromachining param...
Saved in:
| Main Authors: | , , |
|---|---|
| Other Authors: | |
| Format: | Conference Paper |
| Published: |
Institute of Electrical and Electronics Engineers Inc.
2023
|
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Be the first to leave a comment!