Single & multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer
This paper describes the development work on single and multi beam laser grooving technology for 40nm node low-k/ULK semiconductor device. A Nd:YAG ultraviolet (UV) laser diode operating at a wavelength of 355 nm was used in this study. The effects of single and multi beam laser micromachining param...
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| フォーマット: | Conference Paper |
| 出版事項: |
Institute of Electrical and Electronics Engineers Inc.
2023
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