3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process

• Main Authors: Mohammad Nazri M.H., Yong T.C., Yusof F.B., Soon How Thien G., Yoong C.K., Kar Y.B.
• 其他作者: 59150751800
• 格式: Article
• 出版: Emerald Publishing 2025
• 主題: Dies; Heat treatment; Neodymium lasers; Ultraviolet lasers; Yttrium aluminum garnet; (back end of line) BEOL; Back end of lines; Data groups; Die strength; Heat affecting zone; Heat-treatment process; Laser grooving; Scanning electron microscopy; Strength characterization; Three point bend tests

Purpose: Die edge quality with its corresponding die strength are two important factors for excellent dicing quality especially for low-k wafers due to their weak mechanical properties and fragile structures. It is shown in past literatures that laser dicing or grooving does yield good dicing qualit...