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Isothermal annealing induced phase Coarsening in Sn-Ag-Cu and Sn-Ag solders

Organized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis.

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Bibliographic Details
Main Authors: Norainiza, Saud, Azman, Jalar
Other Authors: intanniza@yahoo.com
Format: Working Paper
Language:English
Published: Universiti Malaysia Perlis 2010
Subjects:
Sn-rich phase
Sn-Ag-Cu
Sn-Ag
Annealing
Diffusion
Solder pastes
Microelectronics packaging
Microelectronics
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/7483
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spelling my.unimap-74832010-01-12T01:49:24Z Isothermal annealing induced phase Coarsening in Sn-Ag-Cu and Sn-Ag solders Norainiza, Saud Azman, Jalar intanniza@yahoo.com Sn-rich phase Sn-Ag-Cu Sn-Ag Annealing Diffusion Solder pastes Microelectronics packaging Microelectronics Organized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis. The microstructure study of eutectic Sn-Ag-Cu (SAC) and Sn-Ag solders during isothermal annealing has been investigated. Isothermal annealing temperatures were from 60ºC, to 150ºC for 24 up to 1008 hours of anneal time. Infinite Focus Measurement System (IFM®) and Scanning Electron Microscopy- Energy Dispersive Spectrometry (SEM-EDS) are used for microscopy and elemental analysis. Results showed that Sn-rich phases and eutectic phases appear immediately after reflow. However, the diffusion of eutectic component into Sn-rich phases has altered the microstructure and the growth kinetic of the SAC and Sn-Ag solder, as will be discussed further. 2010-01-12T01:48:49Z 2010-01-12T01:48:49Z 2009-12-01 Working Paper p.1-4 http://hdl.handle.net/123456789/7483 en Proceedings of the Malaysian Metallurgical Conference '09 (MMC'09) Universiti Malaysia Perlis
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Sn-rich phase
Sn-Ag-Cu
Sn-Ag
Annealing
Diffusion
Solder pastes
Microelectronics packaging
Microelectronics
spellingShingle Sn-rich phase
Sn-Ag-Cu
Sn-Ag
Annealing
Diffusion
Solder pastes
Microelectronics packaging
Microelectronics
Norainiza, Saud
Azman, Jalar
Isothermal annealing induced phase Coarsening in Sn-Ag-Cu and Sn-Ag solders
description Organized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis.
author2 intanniza@yahoo.com
author_facet intanniza@yahoo.com
Norainiza, Saud
Azman, Jalar
format Working Paper
author Norainiza, Saud
Azman, Jalar
author_sort Norainiza, Saud
title Isothermal annealing induced phase Coarsening in Sn-Ag-Cu and Sn-Ag solders
title_short Isothermal annealing induced phase Coarsening in Sn-Ag-Cu and Sn-Ag solders
title_full Isothermal annealing induced phase Coarsening in Sn-Ag-Cu and Sn-Ag solders
title_fullStr Isothermal annealing induced phase Coarsening in Sn-Ag-Cu and Sn-Ag solders
title_full_unstemmed Isothermal annealing induced phase Coarsening in Sn-Ag-Cu and Sn-Ag solders
title_sort isothermal annealing induced phase coarsening in sn-ag-cu and sn-ag solders
publisher Universiti Malaysia Perlis
publishDate 2010
url http://dspace.unimap.edu.my/xmlui/handle/123456789/7483
_version_ 1643788837202165760
score 13.209306

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