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Characterization of intermetallic growth of gold ball bonds on aluminum bond pads

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Bibliographic Details
Main Authors: Mohd Khairuddin, Md Arshad, Lim, Moy Fung, Mohammad Nuzaihan Md. Noor, Uda, Hashim
Other Authors: mohd.khairuddin@unimap.edu.my
Format: Article
Language:English
Published: University of Malaya 2009
Subjects:
Au-Al
Interdiffusion
Intermetallic
Gold wire bonding
Aluminum bond pad
Intermetallic growth
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/7421
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spelling my.unimap-74212009-12-15T01:56:53Z Characterization of intermetallic growth of gold ball bonds on aluminum bond pads Mohd Khairuddin, Md Arshad Lim, Moy Fung Mohammad Nuzaihan Md. Noor Uda, Hashim mohd.khairuddin@unimap.edu.my Au-Al Interdiffusion Intermetallic Gold wire bonding Aluminum bond pad Intermetallic growth Link to publisher's homepage at http://ejum.fsktm.um.edu.my/Default.aspx In this paper the intermetallic growth between gold ball bond and aluminum bond pad are studied. It involves thermal aging at 150 °C and 200 °C for various time intervals. The relationship between electrical resistance and intermetallic growth are investigated. Process decapsulation followed by Field Emission Scanning Electron Microscopy (FESEM) are used to determine the intermetallic coverage, intermetallic thickness and Kirkendall void of gold ball on aluminum bond pad. The quantitative Energy Dispersive X-Ray (EDX) is used to determine intermetallic phase composition. The result shows that the electrical resistance increase rapidly with temperature and time reflecting faster interdiffusion rates. The resistance might increases to infinity without degradation in bond strength. The magnitude of intermetallic growth for Au-Al increases with the increases of thermal aging and temperature. Under thermal aging, the void and separation layer propagates further and easily seen after 1000 hours and 40 hours at 150°C and 200°C respectively. 2009-12-15T01:55:56Z 2009-12-15T01:55:56Z 2008 Article International Journal of Mechanical and Materials Engineering (IJMME), vol.3 (2), 2008, pages 187-197. 1823-0334 http://ejum.fsktm.um.edu.my/VolumeListing.aspx?JournalID=19 http://hdl.handle.net/123456789/7421 en University of Malaya
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Au-Al
Interdiffusion
Intermetallic
Gold wire bonding
Aluminum bond pad
Intermetallic growth
spellingShingle Au-Al
Interdiffusion
Intermetallic
Gold wire bonding
Aluminum bond pad
Intermetallic growth
Mohd Khairuddin, Md Arshad
Lim, Moy Fung
Mohammad Nuzaihan Md. Noor
Uda, Hashim
Characterization of intermetallic growth of gold ball bonds on aluminum bond pads
description Link to publisher's homepage at http://ejum.fsktm.um.edu.my/Default.aspx
author2 mohd.khairuddin@unimap.edu.my
author_facet mohd.khairuddin@unimap.edu.my
Mohd Khairuddin, Md Arshad
Lim, Moy Fung
Mohammad Nuzaihan Md. Noor
Uda, Hashim
format Article
author Mohd Khairuddin, Md Arshad
Lim, Moy Fung
Mohammad Nuzaihan Md. Noor
Uda, Hashim
author_sort Mohd Khairuddin, Md Arshad
title Characterization of intermetallic growth of gold ball bonds on aluminum bond pads
title_short Characterization of intermetallic growth of gold ball bonds on aluminum bond pads
title_full Characterization of intermetallic growth of gold ball bonds on aluminum bond pads
title_fullStr Characterization of intermetallic growth of gold ball bonds on aluminum bond pads
title_full_unstemmed Characterization of intermetallic growth of gold ball bonds on aluminum bond pads
title_sort characterization of intermetallic growth of gold ball bonds on aluminum bond pads
publisher University of Malaya
publishDate 2009
url http://dspace.unimap.edu.my/xmlui/handle/123456789/7421
_version_ 1643788809322627072
score 13.222552

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