An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite

• Main Authors: Norainiza, Saud, Rita, Mohd Said, Mohd Arif Anuar, Mohd Salleh, Mohd Nazree, Derman, Mohd Izrul Izwan, Ramli, Norhayanti, Mohd Nasir
• 其他作者: [e-mail]
• 格式: Article
• 语言: English
• 出版: EDP Sciences 2020
• 主题: Titanium oxide (TiO2); Solder
• 在线阅读: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/69170

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