APA Citation

Norainiza, S., & norainiza@unimap.edu.my. (2020). An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite. EDP Sciences.

Chicago Style Citation

Norainiza, Saud, and norainiza@unimap.edu.my. An Investigation of TiO2 Addition On Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite. EDP Sciences, 2020.

MLA Citation

Norainiza, Saud, and norainiza@unimap.edu.my. An Investigation of TiO2 Addition On Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite. EDP Sciences, 2020.

Warning: These citations may not always be 100% accurate.