Cover Image

An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite

Link to publisher's homepage at https://www.matec-conferences.org/

Saved in:
Bibliographic Details
Main Authors: Norainiza, Saud, Rita, Mohd Said, Mohd Arif Anuar, Mohd Salleh, Mohd Nazree, Derman, Mohd Izrul Izwan, Ramli, Norhayanti, Mohd Nasir
Other Authors: norainiza@unimap.edu.my
Format: Article
Language:English
Published: EDP Sciences 2020
Subjects:
Titanium oxide (TiO2)
Solder
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/69170
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.unimap-69170
record_format dspace
spelling my.unimap-691702020-12-30T01:56:44Z An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite Norainiza, Saud Rita, Mohd Said Mohd Arif Anuar, Mohd Salleh Mohd Nazree, Derman Mohd Izrul Izwan, Ramli Norhayanti, Mohd Nasir norainiza@unimap.edu.my Titanium oxide (TiO2) Solder Link to publisher's homepage at https://www.matec-conferences.org/ In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite. Sn-Cu-Ni solder paste composite was produced by mixing TiO2 particle with Sn-Cu-Ni solder paste. The microstructure analysis was carried out by Scanning Electron Microscopy-Energy dispersive X-ray (SEM-EDX). The addition TiO2 particle helps to refine the bulk solder microstructure and suppress the intermetallic compound (IMC) formation at the interface as will be discussed further 2020-12-30T01:56:44Z 2020-12-30T01:56:44Z 2016 Article MATEC Web Conferences, vol.78, 2016, 5 pages 2261-236X (online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/69170 https://doi.org/10.1051/matecconf/20167801070 en 2nd International Conference on Green Design and Manufacture 2016 (IConGDM 2016); EDP Sciences
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Titanium oxide (TiO2)
Solder
spellingShingle Titanium oxide (TiO2)
Solder
Norainiza, Saud
Rita, Mohd Said
Mohd Arif Anuar, Mohd Salleh
Mohd Nazree, Derman
Mohd Izrul Izwan, Ramli
Norhayanti, Mohd Nasir
An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite
description Link to publisher's homepage at https://www.matec-conferences.org/
author2 norainiza@unimap.edu.my
author_facet norainiza@unimap.edu.my
Norainiza, Saud
Rita, Mohd Said
Mohd Arif Anuar, Mohd Salleh
Mohd Nazree, Derman
Mohd Izrul Izwan, Ramli
Norhayanti, Mohd Nasir
format Article
author Norainiza, Saud
Rita, Mohd Said
Mohd Arif Anuar, Mohd Salleh
Mohd Nazree, Derman
Mohd Izrul Izwan, Ramli
Norhayanti, Mohd Nasir
author_sort Norainiza, Saud
title An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite
title_short An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite
title_full An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite
title_fullStr An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite
title_full_unstemmed An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite
title_sort investigation of tio2 addition on microstructure evolution of sn-cu-ni solder paste composite
publisher EDP Sciences
publishDate 2020
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/69170
_version_ 1698698567908065280
score 13.222552

Similar Items