The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering

• Main Authors: ‪Mohd Izrul Izwan, Ramli‬, Mohd Arif Anuar, Mohd Salleh, H., Yasuda, J., Chaiprapa, K., Nogita
• 其他作者: [e-mail]
• 格式: Article
• 语言: English
• 出版: Elsevier 2020
• 主题: Soldering; Solder; Interconnects; Intermetallics; Solid solution; Microstructure; Solder properties
• 在线阅读: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68724

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