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Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology

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Main Authors: Siti Rahmah, Esa, Genesia, Omar, Siti Hajar, Sheikh Md Fadzullah, Kim, S. Siow, B. Abdul Rahim, B. Çoşut
Other Authors: ghazali@utem.edu.my
Format: Article
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2020
Subjects:
Diffusion
Grain size
Mechanism
Microstructure
Sintered Ag
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68696
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spelling my.unimap-686962020-11-11T10:38:46Z Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology Siti Rahmah, Esa Genesia, Omar Siti Hajar, Sheikh Md Fadzullah Kim, S. Siow B. Abdul Rahim B. Çoşut ghazali@utem.edu.my Diffusion Grain size Mechanism Microstructure Sintered Ag Link to publisher's homepage at http://ijneam.unimap.edu.my Sintered Ag has gained strong interest as an important alternative material for interconnect technology in wide bandgap (WBG) semiconductor industries specifically for high thermal dissipations and high-speed applications. This material typically consists of metallic particles bounded by polymer binder expected to diffuse at the temperature much lower than its melting temperature. This paper studies the diffusion mechanism between Ag particles and its microstructural change over different heat treatment temperature that leads to the understanding on the formation of bonding particles into a predominantly solid Ag network as a conducting path for the interconnect systems. The surface diffusion initiated between Ag particles as they come into intimate contact through the formation of necking. Further atomic movement and diffusion between the particles neck resulting in volume expansion, necking growth as well as the transformation of the particle shape from spherical into an elongated structure. This results in the formation of a long chain of connecting particles, which transform the Ag particles into a solid Ag network. 2020-11-11T10:38:46Z 2020-11-11T10:38:46Z 2020-05 Article International Journal of Nanoelectronics and Materials, vol.13(Special Issue), 2020, pages 461-472 1985-5761 (Printed) 1997-4434 (Online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68696 http://ijneam.unimap.edu.my en International Symposium on Science, Technology and Engineering (ISSTE 2019); Universiti Malaysia Perlis (UniMAP)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Diffusion
Grain size
Mechanism
Microstructure
Sintered Ag
spellingShingle Diffusion
Grain size
Mechanism
Microstructure
Sintered Ag
Siti Rahmah, Esa
Genesia, Omar
Siti Hajar, Sheikh Md Fadzullah
Kim, S. Siow
B. Abdul Rahim
B. Çoşut
Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology
description Link to publisher's homepage at http://ijneam.unimap.edu.my
author2 ghazali@utem.edu.my
author_facet ghazali@utem.edu.my
Siti Rahmah, Esa
Genesia, Omar
Siti Hajar, Sheikh Md Fadzullah
Kim, S. Siow
B. Abdul Rahim
B. Çoşut
format Article
author Siti Rahmah, Esa
Genesia, Omar
Siti Hajar, Sheikh Md Fadzullah
Kim, S. Siow
B. Abdul Rahim
B. Çoşut
author_sort Siti Rahmah, Esa
title Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology
title_short Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology
title_full Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology
title_fullStr Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology
title_full_unstemmed Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology
title_sort diffusion mechanism of silver particles in polymer binder for die attach interconnect technology
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2020
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68696
_version_ 1698698497637744640
score 13.214268

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