Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology
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Universiti Malaysia Perlis (UniMAP)
2020
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my.unimap-686962020-11-11T10:38:46Z Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology Siti Rahmah, Esa Genesia, Omar Siti Hajar, Sheikh Md Fadzullah Kim, S. Siow B. Abdul Rahim B. Çoşut ghazali@utem.edu.my Diffusion Grain size Mechanism Microstructure Sintered Ag Link to publisher's homepage at http://ijneam.unimap.edu.my Sintered Ag has gained strong interest as an important alternative material for interconnect technology in wide bandgap (WBG) semiconductor industries specifically for high thermal dissipations and high-speed applications. This material typically consists of metallic particles bounded by polymer binder expected to diffuse at the temperature much lower than its melting temperature. This paper studies the diffusion mechanism between Ag particles and its microstructural change over different heat treatment temperature that leads to the understanding on the formation of bonding particles into a predominantly solid Ag network as a conducting path for the interconnect systems. The surface diffusion initiated between Ag particles as they come into intimate contact through the formation of necking. Further atomic movement and diffusion between the particles neck resulting in volume expansion, necking growth as well as the transformation of the particle shape from spherical into an elongated structure. This results in the formation of a long chain of connecting particles, which transform the Ag particles into a solid Ag network. 2020-11-11T10:38:46Z 2020-11-11T10:38:46Z 2020-05 Article International Journal of Nanoelectronics and Materials, vol.13(Special Issue), 2020, pages 461-472 1985-5761 (Printed) 1997-4434 (Online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68696 http://ijneam.unimap.edu.my en International Symposium on Science, Technology and Engineering (ISSTE 2019); Universiti Malaysia Perlis (UniMAP) |
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Universiti Malaysia Perlis |
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http://dspace.unimap.edu.my/ |
| language |
English |
| topic |
Diffusion Grain size Mechanism Microstructure Sintered Ag |
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Diffusion Grain size Mechanism Microstructure Sintered Ag Siti Rahmah, Esa Genesia, Omar Siti Hajar, Sheikh Md Fadzullah Kim, S. Siow B. Abdul Rahim B. Çoşut Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology |
| description |
Link to publisher's homepage at http://ijneam.unimap.edu.my |
| author2 |
ghazali@utem.edu.my |
| author_facet |
ghazali@utem.edu.my Siti Rahmah, Esa Genesia, Omar Siti Hajar, Sheikh Md Fadzullah Kim, S. Siow B. Abdul Rahim B. Çoşut |
| format |
Article |
| author |
Siti Rahmah, Esa Genesia, Omar Siti Hajar, Sheikh Md Fadzullah Kim, S. Siow B. Abdul Rahim B. Çoşut |
| author_sort |
Siti Rahmah, Esa |
| title |
Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology |
| title_short |
Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology |
| title_full |
Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology |
| title_fullStr |
Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology |
| title_full_unstemmed |
Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology |
| title_sort |
diffusion mechanism of silver particles in polymer binder for die attach interconnect technology |
| publisher |
Universiti Malaysia Perlis (UniMAP) |
| publishDate |
2020 |
| url |
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68696 |
| _version_ |
1698698497637744640 |
| score |
13.209306 |