Description: Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology

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Bibliographic Details
Main Authors:	Siti Rahmah, Esa, Genesia, Omar, Siti Hajar, Sheikh Md Fadzullah, Kim, S. Siow, B. Abdul Rahim, B. Çoşut
Other Authors:	ghazali@utem.edu.my
Format:	Article
Language:	English
Published:	Universiti Malaysia Perlis (UniMAP) 2020
Subjects:	Diffusion Grain size Mechanism Microstructure Sintered Ag
Online Access:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68696
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Summary:	Link to publisher's homepage at http://ijneam.unimap.edu.my