Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste

• Main Authors: Rita, Mohd Said, Mohd Arif Anuar, Mohd Salleh, Mohd Nazree, Derman, Mohd Izrul, Izwan Ramli, Norhayanti, Mohd Nasir, Norainiza, Saud
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: Trans Tech Publications Ltd. 2019
• Subjects: Intermetallic compound; Isothermal aging; Sn-Cu-Ni solder paste; Soldering; TiO2
• Online Access: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/63578

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