Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste
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2019
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my.unimap-635782019-12-03T08:33:53Z Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste Rita, Mohd Said Mohd Arif Anuar, Mohd Salleh Mohd Nazree, Derman Mohd Izrul, Izwan Ramli Norhayanti, Mohd Nasir Norainiza, Saud ritamohdsaid15@gmail.com arifanuar@unimap.edu.my nazreederman@gmail.com mohdizrulizwan@gmail.com hayantinet@gmail.com norainiza@unimap.edu.my Intermetallic compound Isothermal aging Sn-Cu-Ni solder paste Soldering TiO2 Link to publisher's homepage at https://www.scientific.net This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste with TiO2 particles were mechanically mixed to fabricate the composite solder paste. The composite solder paste then reflowed in the reflow oven to form solder joint. The reflowed samples were then isothermally aged 75, 125 and 150 ° C for 24 and 240 h. It was found that the morphology of IMCs changed from scallop-shape to a more uniform planar shape in both Sn-Cu-Ni/Cu joints and Sn-Cu-Ni-TiO2 /Cu joint. Cu6Sn5 and Cu3Sn IMC were identified and grew after prolong aging time and temperature. The IMCs thickness and scallop diameter of composite solder paste were reduced and the growth of IMCs thickness after isothermal aging become slower as compared to unreinforced Sn-Cu-Ni solder paste. It is suggested that TiO2 particles have influenced the evolution and retarded the growth of interfacial IMCs. 2019-12-03T08:33:53Z 2019-12-03T08:33:53Z 2016-07 Article Key Engineering Materials, vol.700, 2016, 123-131. 1662-9795 http://dspace.unimap.edu.my:80/xmlui/handle/123456789/63578 https://www.scientific.net/KEM.700.123 en Trans Tech Publications Ltd. |
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Intermetallic compound Isothermal aging Sn-Cu-Ni solder paste Soldering TiO2 |
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Intermetallic compound Isothermal aging Sn-Cu-Ni solder paste Soldering TiO2 Rita, Mohd Said Mohd Arif Anuar, Mohd Salleh Mohd Nazree, Derman Mohd Izrul, Izwan Ramli Norhayanti, Mohd Nasir Norainiza, Saud Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste |
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Link to publisher's homepage at https://www.scientific.net |
| author2 |
ritamohdsaid15@gmail.com |
| author_facet |
ritamohdsaid15@gmail.com Rita, Mohd Said Mohd Arif Anuar, Mohd Salleh Mohd Nazree, Derman Mohd Izrul, Izwan Ramli Norhayanti, Mohd Nasir Norainiza, Saud |
| format |
Article |
| author |
Rita, Mohd Said Mohd Arif Anuar, Mohd Salleh Mohd Nazree, Derman Mohd Izrul, Izwan Ramli Norhayanti, Mohd Nasir Norainiza, Saud |
| author_sort |
Rita, Mohd Said |
| title |
Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste |
| title_short |
Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste |
| title_full |
Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste |
| title_fullStr |
Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste |
| title_full_unstemmed |
Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste |
| title_sort |
isothermal aging affect to the growth of sn-cu-ni-1 wt. % tio2 composite solder paste |
| publisher |
Trans Tech Publications Ltd. |
| publishDate |
2019 |
| url |
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/63578 |
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1654961445126799360 |
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13.214268 |