Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste

• Main Authors: Rita, Mohd Said, Mohd Arif Anuar, Mohd Salleh, Mohd Nazree, Derman, Mohd Izrul, Izwan Ramli, Norhayanti, Mohd Nasir, Norainiza, Saud
• 其他作者: [e-mail]
• 格式: Article
• 語言: English
• 出版: Trans Tech Publications Ltd. 2019
• 主題: Intermetallic compound; Isothermal aging; Sn-Cu-Ni solder paste; Soldering; TiO2
• 在線閱讀: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/63578

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