Improvement in processing of micro and nano structure fabrication using O₂ plasma

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Main Authors: Ahmed, N. M., Dhahi, Th Sabar, Uda, Hashim
Other Authors: sthikra@yahoo.com.
Format: Article
Language:English
Published: Universiti Malaysia Perlis 2016
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Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/41229
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spelling my.unimap-412292017-11-21T03:41:48Z Improvement in processing of micro and nano structure fabrication using O₂ plasma Ahmed, N. M. Dhahi, Th Sabar Uda, Hashim sthikra@yahoo.com. Plasma Etching Photolithography Nanogap Electrodes Link to publisher's homepage at http://ijneam.unimap.edu.my/ Plasma has frequently been used by the industry as a last step surface preparation technique in an otherwise wet-etched process. Recent research of the chemistry of plasma led to a great understanding of plasma processes. It is by controlling the plasma conditions and gas mixture, ultra-fast plasma cleaning and etching is possible. With enhanced organic removal rates, plasma processed become more desirable as an environmentally sound alternative to traditional solvent or acid dominated process, not only as a cleaning tool, but also as a patterning and machining tool. In this paper, improvement in the processing of nanogap fabrication using O₂ plasma is discussed including the parameters for PR patterning with two times limited in the O₂ plasma process. For applications that have not been possible with limited usefulness, plasma processes are now approaching the realm of possibility. We introduce this work to fabricate and characterize the nanogap device fabrication O₂ plasma technique for biosensor fabrication. In this review, two masks design are proposed. The first mask is for the lateral nanogap and the second mask is for a gold pad electrode pattern, and the lateral nanogap is introduced in the fabrication process using silicon, and gold as an electrode. Conventional photolithography technique is used to fabricate this nanogap (NG) based on the plasma etching technique. The increase in etching time when we apply the O₂ plasma means an increase in the amount of etching, while in the case of reducing the time of etching means reducing the amount of etching, as shown in the results. 2016-03-31T04:36:58Z 2016-03-31T04:36:58Z 2011 Article International Journal of Nanoelectronics and Materials, vol.4 (1), 2011, pages 37-48 1985-5761 (Printed) 1997-4434 (Online) http://ijneam.unimap.edu.my/ http://dspace.unimap.edu.my:80/xmlui/handle/123456789/41229 en Universiti Malaysia Perlis
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Plasma Etching
Photolithography
Nanogap
Electrodes
spellingShingle Plasma Etching
Photolithography
Nanogap
Electrodes
Ahmed, N. M.
Dhahi, Th Sabar
Uda, Hashim
Improvement in processing of micro and nano structure fabrication using O₂ plasma
description Link to publisher's homepage at http://ijneam.unimap.edu.my/
author2 sthikra@yahoo.com.
author_facet sthikra@yahoo.com.
Ahmed, N. M.
Dhahi, Th Sabar
Uda, Hashim
format Article
author Ahmed, N. M.
Dhahi, Th Sabar
Uda, Hashim
author_sort Ahmed, N. M.
title Improvement in processing of micro and nano structure fabrication using O₂ plasma
title_short Improvement in processing of micro and nano structure fabrication using O₂ plasma
title_full Improvement in processing of micro and nano structure fabrication using O₂ plasma
title_fullStr Improvement in processing of micro and nano structure fabrication using O₂ plasma
title_full_unstemmed Improvement in processing of micro and nano structure fabrication using O₂ plasma
title_sort improvement in processing of micro and nano structure fabrication using o₂ plasma
publisher Universiti Malaysia Perlis
publishDate 2016
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/41229
_version_ 1643802785893842944
score 13.222552