High power LED heat dissipation analysis via copper diamond slug

• Main Authors: Vairavan, Rajendaran, Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
• 其他作者: [e-mail]
• 格式: Article
• 语言: English
• 出版: AENSI Publisher All rights reserved 2014
• 主题: Ansys; Cylindrical copper diamond composite heat slug; GaN LED; Junction temperature
• 在线阅读: http://dspace.unimap.edu.my:80/dspace/handle/123456789/35663

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