Holdings: High power LED heat dissipation analysis via copper diamond slug

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Bibliographic Details
Main Authors:	Vairavan, Rajendaran, Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
Other Authors:	rajendaran@gmail.com
Format:	Article
Language:	English
Published:	AENSI Publisher All rights reserved 2014
Subjects:	Ansys Cylindrical copper diamond composite heat slug GaN LED Junction temperature
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/35663
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