Shear speed analysis on Sn-3.9Ag-0.6Cu Solder
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2014
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my.unimap-353872014-06-11T08:52:20Z Shear speed analysis on Sn-3.9Ag-0.6Cu Solder Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Fairul Afzal, Ahmad Fuad Ehkan, Phaklen, Dr. Ong, Tee Say Vairavan, Rajendaran zaliman@unimap.edu.my vc.sundress@gmail.com fairul@unimap.edu.my phaklen@unimap.edu.my Ansys Ball grid array (BGA) Shear speed Stress Link to publisher's homepage at http://www.ttp.net/ Ball Grid Array (BGA) is a type of semiconductor interconnection used in Integrated Circuit (IC) which is being scaled down to micro and nano size. The reliability of BGA in IC becomes a concern as the size of IC reduces. Hence, this leads to the study of stress on the BGA. This paper discussed the load effects of varying shear speed analysis on the BGA. A Pb-free material, Sn-3.9Ag-0.6Cu solder was applied in the simulation. Shear height value is fixed while the shear speed is varied to investigate the dynamic stress on a BGA package using Ansys software. The results from the graph plotted showed that higher shear speed results to higher shear force. 2014-06-11T08:52:20Z 2014-06-11T08:52:20Z 2013 Article Applied Mechanics and Materials, vol. 404, 2013, pages 72-76 978-303785845-5 1660-9336 http://www.scientific.net/AMM.404.72 http://dspace.unimap.edu.my:80/dspace/handle/123456789/35387 en Trans Tech Publications (TTP) |
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Universiti Malaysia Perlis |
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Malaysia |
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Universiti Malaysia Perlis |
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http://dspace.unimap.edu.my/ |
| language |
English |
| topic |
Ansys Ball grid array (BGA) Shear speed Stress |
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Ansys Ball grid array (BGA) Shear speed Stress Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Fairul Afzal, Ahmad Fuad Ehkan, Phaklen, Dr. Ong, Tee Say Vairavan, Rajendaran Shear speed analysis on Sn-3.9Ag-0.6Cu Solder |
| description |
Link to publisher's homepage at http://www.ttp.net/ |
| author2 |
zaliman@unimap.edu.my |
| author_facet |
zaliman@unimap.edu.my Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Fairul Afzal, Ahmad Fuad Ehkan, Phaklen, Dr. Ong, Tee Say Vairavan, Rajendaran |
| format |
Article |
| author |
Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Fairul Afzal, Ahmad Fuad Ehkan, Phaklen, Dr. Ong, Tee Say Vairavan, Rajendaran |
| author_sort |
Zaliman, Sauli, Dr. |
| title |
Shear speed analysis on Sn-3.9Ag-0.6Cu Solder |
| title_short |
Shear speed analysis on Sn-3.9Ag-0.6Cu Solder |
| title_full |
Shear speed analysis on Sn-3.9Ag-0.6Cu Solder |
| title_fullStr |
Shear speed analysis on Sn-3.9Ag-0.6Cu Solder |
| title_full_unstemmed |
Shear speed analysis on Sn-3.9Ag-0.6Cu Solder |
| title_sort |
shear speed analysis on sn-3.9ag-0.6cu solder |
| publisher |
Trans Tech Publications (TTP) |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/35387 |
| _version_ |
1643797779738263552 |
| score |
13.214268 |