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Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate

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Main Authors: Mohd Arif Anuar, Mohd Salleh, Noraniza, Saud, S.I, Najib
Other Authors: arifanuar@unimap.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Composite
Growth kinetics
Intermetallic
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/34876
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spelling my.unimap-348762014-05-29T08:43:22Z Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate Mohd Arif Anuar, Mohd Salleh Noraniza, Saud S.I, Najib arifanuar@unimap.edu.my Composite Growth kinetics Intermetallic Link to publisher's homepage at http://www.scientific.net/ The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic assemblies industry. In this investigation, we used Sn-0.7Cu/1.0-Si3N4 composite solder to analyze its interfacial joint on Cu substrate. Various isothermal of aging times were carried in this study by using 24hrs, 240hrs, 480hrs, 600hrs and 720hrs at 150°C of aging temperature. The Cu-Sn IMC thickness was increase with increasing aging time and the diffusion coefficient of this composite solder is 1.16x10-16m2/s. 2014-05-29T08:43:22Z 2014-05-29T08:43:22Z 2013 Article Advanced Materials Research, vol.795, 2013, pages 505-508 1662-8985 http://www.scientific.net/AMR.795.505 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34876 10.4028/www.scientific.net/AMR.795.505 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Composite
Growth kinetics
Intermetallic
spellingShingle Composite
Growth kinetics
Intermetallic
Mohd Arif Anuar, Mohd Salleh
Noraniza, Saud
S.I, Najib
Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate
description Link to publisher's homepage at http://www.scientific.net/
author2 arifanuar@unimap.edu.my
author_facet arifanuar@unimap.edu.my
Mohd Arif Anuar, Mohd Salleh
Noraniza, Saud
S.I, Najib
format Article
author Mohd Arif Anuar, Mohd Salleh
Noraniza, Saud
S.I, Najib
author_sort Mohd Arif Anuar, Mohd Salleh
title Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate
title_short Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate
title_full Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate
title_fullStr Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate
title_full_unstemmed Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate
title_sort effect of aging time towards intermetallic compound (imc) growth kinetics formation for sn-0.7cu-si3n4 composite solder on copper substrate
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/34876
_version_ 1643797642135732224
score 13.214268

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