Description: Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate

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Bibliographic Details
Main Authors:	Mohd Arif Anuar, Mohd Salleh, Noraniza, Saud, S.I, Najib
Other Authors:	arifanuar@unimap.edu.my
Format:	Article
Language:	English
Published:	Trans Tech Publications 2014
Subjects:	Composite Growth kinetics Intermetallic
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/34876
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Summary:	Link to publisher's homepage at http://www.scientific.net/