Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate

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Bibliographic Details
Main Authors: Mohd Arif Anuar, Mohd Salleh, Noraniza, Saud, S.I, Najib
Other Authors: arifanuar@unimap.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
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Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/34876
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