Comparative reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging

• Main Authors: Gan, Chong Leong, Uda, Hashim, Prof. Dr.
• 其他作者: [e-mail]
• 格式: Article
• 语言: English
• 出版: Public Library of Science 2014
• 主题: Gold (Au); Palladium (Pd) coated Cu; Pd-doped Cu wires; Microelectronics
• 在线阅读: http://dspace.unimap.edu.my:80/dspace/handle/123456789/34036

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