Gan, C. L., & clgan_pgg@yahoo.com. (2014). Comparative reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging. Public Library of Science.
Chicago Style CitationGan, Chong Leong, and clgan_pgg@yahoo.com. Comparative Reliability Studies and Analysis of Au, Pd-coated Cu and Pd-doped Cu Wire in Microelectronics Packaging. Public Library of Science, 2014.
MLA CitationGan, Chong Leong, and clgan_pgg@yahoo.com. Comparative Reliability Studies and Analysis of Au, Pd-coated Cu and Pd-doped Cu Wire in Microelectronics Packaging. Public Library of Science, 2014.
Warning: These citations may not always be 100% accurate.