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Comparative reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging

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Main Authors: Gan, Chong Leong, Uda, Hashim, Prof. Dr.
Other Authors: clgan_pgg@yahoo.com
Format: Article
Language:English
Published: Public Library of Science 2014
Subjects:
Gold (Au)
Palladium (Pd) coated Cu
Pd-doped Cu wires
Microelectronics
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/34036
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spelling my.unimap-340362014-04-24T14:13:23Z Comparative reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging Gan, Chong Leong Uda, Hashim, Prof. Dr. clgan_pgg@yahoo.com uda@unimap.edu.my Gold (Au) Palladium (Pd) coated Cu Pd-doped Cu wires Microelectronics Link to publisher's homepage at http://www.plos.org/ This paper compares and discusses the wearout reliability and analysis of Gold (Au), Palladium (Pd) coated Cu and Pd-doped Cu wires used in fineline Ball Grid Array (BGA) package. Intermetallic compound (IMC) thickness measurement has been carried out to estimate the coefficient of diffusion (Do ) under various aging conditions of different bonding wires. Wire pull and ball bond shear strengths have been analyzed and we found smaller variation in Pd-doped Cu wire compared to Au and Pd-doped Cu wire. Au bonds were identified to have faster IMC formation, compared to slower IMC growth of Cu. The obtained weibull slope, b of three bonding wires are greater than 1.0 and belong to wearout reliability data point. Pd-doped Cu wire exhibits larger time-to-failure and cycles-to-failure in both wearout reliability tests in Highly Accelerated Temperature and Humidity (HAST) and Temperature Cycling (TC) tests. This proves Pd-doped Cu wire has a greater potential and higher reliability margin compared to Au and Pd-coated Cu wires. 2014-04-24T14:13:23Z 2014-04-24T14:13:23Z 2013-11 Article PLoS ONE, vol. 8(11), 2013, pages 1-8 1932-6203 http://www.plosone.org/article/info%3Adoi%2F10.1371%2Fjournal.pone.0078705 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34036 en Public Library of Science
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Gold (Au)
Palladium (Pd) coated Cu
Pd-doped Cu wires
Microelectronics
spellingShingle Gold (Au)
Palladium (Pd) coated Cu
Pd-doped Cu wires
Microelectronics
Gan, Chong Leong
Uda, Hashim, Prof. Dr.
Comparative reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging
description Link to publisher's homepage at http://www.plos.org/
author2 clgan_pgg@yahoo.com
author_facet clgan_pgg@yahoo.com
Gan, Chong Leong
Uda, Hashim, Prof. Dr.
format Article
author Gan, Chong Leong
Uda, Hashim, Prof. Dr.
author_sort Gan, Chong Leong
title Comparative reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging
title_short Comparative reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging
title_full Comparative reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging
title_fullStr Comparative reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging
title_full_unstemmed Comparative reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging
title_sort comparative reliability studies and analysis of au, pd-coated cu and pd-doped cu wire in microelectronics packaging
publisher Public Library of Science
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/34036
_version_ 1643797378947350528
score 13.223943

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