Thermal management of multichipmodule (MCM) using genetic algorithms

• Main Authors: Jeevan, Kanesan, Seetharamu, Kankanhally N., Ishak, I.A., Ghulam, Abdul Quadir, Prof. Dr.
• 其他作者: [e-mail]
• 格式: Working Paper
• 語言: English
• 出版: IEEE Conference Publications 2014
• 主題: Genetic algorithms; Thermal management; Energy dissipation; Boundary conditions
• 在線閱讀: http://dspace.unimap.edu.my:80/dspace/handle/123456789/33954

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