Thermal management of multichipmodule (MCM) using genetic algorithms

• Main Authors: Jeevan, Kanesan, Seetharamu, Kankanhally N., Ishak, I.A., Ghulam, Abdul Quadir, Prof. Dr.
• Other Authors: [e-mail]
• Format: Working Paper
• Language: English
• Published: IEEE Conference Publications 2014
• Subjects: Genetic algorithms; Thermal management; Energy dissipation; Boundary conditions
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/33954

Link to publisher's homepage at http://ieeexplore.ieee.org/