Holdings: Thermal management of multichipmodule (MCM) using genetic algorithms

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Bibliographic Details
Main Authors:	Jeevan, Kanesan, Seetharamu, Kankanhally N., Ishak, I.A., Ghulam, Abdul Quadir, Prof. Dr.
Other Authors:	knseetharamu@hotmail.com
Format:	Working Paper
Language:	English
Published:	IEEE Conference Publications 2014
Subjects:	Genetic algorithms Thermal management Energy dissipation Boundary conditions
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33954
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