Optimization of liquid cooling fins in microelectronic packaging
Link to publisher's homepage at http://www.tandfonline.com/
Saved in:
Main Authors: | Ng, N. T., Lai, K. W., Ghulam, Quadir, Prof. Dr., Seetharamu, Kankanhally N., Ishak, Abdul Azid, Dr., Zainal Alimuddin, Zainal Alauddin, Dr. |
---|---|
Format: | Article |
Language: | English |
Published: |
Taylor & Francis Online
2014
|
Subjects: | |
Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/33926 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Optimization of fins used in electronic packaging
by: Ong, Kang Eu, et al.
Published: (2014) -
Test chip and substrate design for flip chip microelectronic package thermal measurements
by: Goh, Teck Joo, et al.
Published: (2014) -
Optimization of thermal resistance of stacked micro-channel using genetic algorithms
by: Jeevan, Kanesan, et al.
Published: (2014) -
Microelectronics: Sensors and Devices
by: Mukhzeer, Mohamad Shahimin (Editor), et al.
Published: (2017) -
Affordable and Effective Microelectronic Engineering Teaching Package for Undergraduate Programme
by: Uda, Hashim, Prof. Dr., et al.
Published: (2010)