Optimization of liquid cooling fins in microelectronic packaging
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Taylor & Francis Online
2014
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my.unimap-339262014-04-23T01:30:50Z Optimization of liquid cooling fins in microelectronic packaging Ng, N. T. Lai, K. W. Ghulam, Quadir, Prof. Dr. Seetharamu, Kankanhally N. Ishak, Abdul Azid, Dr. Zainal Alimuddin, Zainal Alauddin, Dr. Fins Liquid cooling Microelectronics Optimization Link to publisher's homepage at http://www.tandfonline.com/ The present study investigates the heat transfer from a fin of the combination of cone and frustum of a cone immersed in boiling FC-72. The temperature distribution within the fin is determined with the help of a three-dimensional finite element computation technique using linear axisymmetric elements. From the temperature distribution, the fin base temperature gradients at various base temperature excesses are obtained. The numerical results are found to be in good agreement with published experimental data. Parametric studies have been carried out using this numerical method. An artificial neural network is used to consolidate additional data from the parametric studies. The genetic algorithm is then applied to the case of a fixed volume fin, in order to determine the dimensions which optimize the heat transfer per unit volume. It is observed that the heat transfer per unit volume decreases with fins of increasing volumes. Conclusively, the technique used in the analysis is able to provide a fast and accurate guideline to select and design the cooling for microelectronic systems. 2014-04-23T01:30:50Z 2014-04-23T01:30:50Z 2005 Article Engineering Optimization, vol. 35(4), 2003, pages 359-374 0305-215X http://dspace.unimap.edu.my:80/dspace/handle/123456789/33926 http://www.tandfonline.com/doi/abs/10.1080/0305215031000147594?journalCode=geno20#.U1cN7lWSxOI 10.1080/0305215031000147594 en Taylor & Francis Online |
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Universiti Malaysia Perlis |
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Malaysia |
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Universiti Malaysia Perlis |
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http://dspace.unimap.edu.my/ |
| language |
English |
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Fins Liquid cooling Microelectronics Optimization |
| spellingShingle |
Fins Liquid cooling Microelectronics Optimization Ng, N. T. Lai, K. W. Ghulam, Quadir, Prof. Dr. Seetharamu, Kankanhally N. Ishak, Abdul Azid, Dr. Zainal Alimuddin, Zainal Alauddin, Dr. Optimization of liquid cooling fins in microelectronic packaging |
| description |
Link to publisher's homepage at http://www.tandfonline.com/ |
| format |
Article |
| author |
Ng, N. T. Lai, K. W. Ghulam, Quadir, Prof. Dr. Seetharamu, Kankanhally N. Ishak, Abdul Azid, Dr. Zainal Alimuddin, Zainal Alauddin, Dr. |
| author_facet |
Ng, N. T. Lai, K. W. Ghulam, Quadir, Prof. Dr. Seetharamu, Kankanhally N. Ishak, Abdul Azid, Dr. Zainal Alimuddin, Zainal Alauddin, Dr. |
| author_sort |
Ng, N. T. |
| title |
Optimization of liquid cooling fins in microelectronic packaging |
| title_short |
Optimization of liquid cooling fins in microelectronic packaging |
| title_full |
Optimization of liquid cooling fins in microelectronic packaging |
| title_fullStr |
Optimization of liquid cooling fins in microelectronic packaging |
| title_full_unstemmed |
Optimization of liquid cooling fins in microelectronic packaging |
| title_sort |
optimization of liquid cooling fins in microelectronic packaging |
| publisher |
Taylor & Francis Online |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/33926 |
| _version_ |
1643797349147869184 |
| score |
13.214268 |